Submillimeter-Wave Advanced Technologies
DRIE Technology for the Fabrication of Submillimeter-Wave Components
JPL is using deep reactive ion etching (DRIE)-based silicon micromachining capabilities to develop the critical waveguide components at submillimeter wavelengths that will lead to highly integrated multipixel spectrometers, imagers, and radars. A silicon-based quadrature hybrid working in the 325–500-GHz range has been designed and initial fabrication is in progress.
Silicon micromachining was utilized to fabricate a quadrature hybrid at 325 GHz.