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Infrastructure

Above: Lithographic patterning capabilities are housed within MDL cleanroom areas lighted “yellow” to avoid exposing emulsions sensitive to “blue” wavelengths of light. This is only one of eight equipment complement categories requiring continual investment to remain state-of-the-art and relevant to fabricate improved sensors for instrumentation. Above: Lithographic patterning capabilities are housed within MDL cleanroom areas lighted “yellow” to avoid exposing emulsions sensitive to “blue” wavelengths of light. This is only one of eight equipment complement categories requiring continual investment to remain state-of-the-art and relevant to fabricate improved sensors for instrumentation.

Equipment

Equipment within MDL must be maintained, reviewed, and updated on a continual basis in order to enable researchers to fabricate improved sensors for instrumentation. Investments in new capabilities, upgrades and replacements are prioritized and analyzed annually by need and available resources in accordance with a five-year investment plan. The current MDL equipment complement is delineated below in eight (8) categories.

MDL Equipment Complement

Material Deposition

Material Deposition

  • Thermal Evaporators (6)
  • Electron-Beam Evaporators (7)
  • Angstrom Engineering Indium-Metal Evaporator
  • AJA Load Locked Thermal Co-Evaporator for Broadband IR Bolometer Depositions
  • PlasmaTherm 790 Plasma Enhanced Chemical Vapor Deposition (PECVD) for Dielectrics
  • Oxford Plasmalab System 100 Advanced Inductively Coupled Plasma (ICP) 380 High-Density Plasma Enhanced Chemical Vapor Deposition (HD PECVD) System for Low-Temperature Dielectric Growths
  • Oxford Plasmalab 80 OpAL Atomic Layer Deposition (ALD) System with Radical Enhanced Upgrade
  • Beneq TFS-200 Atomic Layer Deposition (ALD) System
  • Tystar (150-mm/6-inch) Low-Pressure Chemical Vapor Deposition (LPCVD) with 2 Tubes for
    • Low-Stress Silicon Nitride
    • Atmospheric Wet/Dry Oxidation
  • Carbon Nanotube (CNT) Growth Furnace Systems (2)
  • Electroplating Capabilities
  • Molecular-Beam Epitaxy (MBE)
    • Veeco GEN200 (200-mm/8-inch) Si MBE for UV CCD Delta Doping (Silicon)
    • Veeco Epi GEN III MBE (Antimonide Materials)
    • Riber MBE for UV CCD Delta Doping (Silicon)
    • Riber Device MBE (GaAs)
  • Ultra-High-Vacuum (UHV) Sputtering Systems for Dielectrics and Metals (3)
  • Ultra-High-Vacuum (UHV) Sputtering Systems for Superconducting Materials (4)

Lithographic Patterning

Lithographic Patterning

  • Electron-Beam (E-beam) Lithography: JEOL JBX9300FS e-beam lithography system with a 4-nm spot size, 100,000-volt acceleration voltage, ability to handle wafers up to 9 inches in diameter, and hardware and software modifications to deal with curved substrates having up to 7 mm of sag
  • GCA Mann Wafer Stepper with custom stage allowing different sizes and thicknesses of wafers (0.7-µm res.)
  • Canon FPA3000 i4 i-Line Stepper (0.35-µm res.)
  • Canon FPA3000 EX3 Stepper with EX4 Optics (0.25-µm res.)
  • Canon FPA3000 EX6 DUV Stepper (0.15-µm res.)
  • Contact Aligners:
    • Karl Suss MJB3
    • Karl Suss MJB3 with backside IR
    • Suss MA-6 (UV300) with MO Exposure Optics upgrade
    • Suss BA-6 (UV400) with jigging supporting Suss bonder
  • Wafer Track/Resist/Developer Dispense Systems:
    • Suss Gamma 4-Module Cluster System
    • Site Services Spin Developer System
    • SolarSemi MC204 Microcluster Spin Coating System
  • Yield Engineering System (YES) Reversal Oven
  • Ovens, Hotplates, Furnaces, and Manual Spinners (including 2 Solitec 5110C spinners, and a Suss RC8 Spin Coater)

Dry Etching

Dry Etching

  • Commonwealth IBE-80 Ion Mill
  • Branson Plasma Ashers (2)
  • Tepla PP300SA Microwave Plasma Asher

Fluorine-Based Plasma Etching Systems

Fluorine-Based Plasma Etching Systems

  • STS Deep Trench Reactive Ion Etcher (DRIE) with SOI Upgrade
  • PlasmaTherm Versaline Deep Silicon Etcher (DSE/DRIE)
  • Unaxis Shuttleline Load-Locked Fluorine Inductively Coupled Plasma (ICP) RIE
  • PlasmaTherm APEX SLR Fluorine-based ICP RIE with Laser End Point Detector
  • Plasmaster RME-1200 Fluorine RIE
  • Plasma Tech Fluorine RIE
  • STJ RIE for Superconductors

Chlorine-based Plasma Etching Systems

Chlorine-based Plasma Etching Systems

  • Unaxis Shuttleline Load-Locked Chlorine Inductively Coupled Plasma (ICP) RIE
  • PlasmaTherm Versaline Chlorine-based ICP Etcher
  • Oxford ICP Chlorine RIE

Wet Etching & Sample Preparation

Wet Etching & Sample Preparation

  • RCA Acid Wet Bench for 6-inch Wafers
  • Solvent Wet Processing Benches (7)
  • Rinser/Dryers for Wafers including Semitool 870S Dual Spin Rinser Dryer
  • Chemical Hoods (7)
  • Acid Wet Processing Benches (8)
  • Jelight UVO-Cleaners (2
  • Tousimis 915B Critical Point Dryer
  • Rapid Thermal Processors/Contact Alloyers (2)
  • Polishing and Planarization Stations (5)
  • Strasbaugh 6EC Chemical Mechanical Polisher
  • Precitech Nanonform 250 Ultra Diamond Point Turning System
  • SET North America Ontos 7 Native Oxide (Indium Oxide) Removal Tool
  • SurfX 400L Atmospheric Surface Preparation System
  • New Wave Research EzLaze 3 Laser Cutting System
  • Indonus HF VPE-150 Hydrofluoric Acid Vapor Phase Etcher

Packaging

Packaging

  • SET FC-300 Flip Chip Bump Bonder
  • Karl Suss Wafer Bonder
  • Electronic Visions Wafer Bonder
  • Finetech Fineplacer 96 “Lambda” Bump Bonder
  • Thinning Station and Inspection Systems for CCD Thinning
  • Wire Bonding
  • DISCO 320 and 321 Wafer Dicers (2)
  • Tempress Scriber
  • Pick and Place Blue Tape Dispenser System
  • Loomis LSD-100 Scriber Breaker
  • SCS Labcoater 2 (PDS 2010) Parylene Coating System

Characterization

Characterization

  • Profilometers (3) (Dektak 8, Alphastep 250 and Alphastep 500)
  • Frontier Semiconductor FSM 128-NT (200-mm/8-inch) Film Stress and Wafer Bow Mapping
  • System
  • FISBA μPhase 2 HR Compact Optical Interferometer
  • Sentech SE 850 Multispectral Ellipsometer
  • Horiba UVSEL 2 (190–2100 nm) Ellipsometer
  • Dimension 5000 Atomic Force Microscope (AFM)
  • KLA-Tencor Surfscan 6220 Wafer Particle Monitor
  • JEOL JSM-6700 Field Emission SEM with EDX
  • Nanospec 2000 Optical Profilometer
  • Nikon and Zeiss Inspection Microscopes with Image Capture (3)
  • Olympus LEXT 3D Confocal Microscope
  • Electrical Probe Stations with Parameter Analyzers (2)
  • RPM2035 Photoluminescence Mapping System
  • Fourier Transform Infrared (FTIR) Spectroscopy
  • PANalytical X’Pert Pro MRD with DHS High Temperature Stage X-ray Diffraction System
  • Surface Science SSX501 XPS with Thermal Stage
  • Custom Ballistic Electron Emission Microscopy (BEEM) System
  • Custom UHV Scanning Tunneling Microscope (STM)
  • Nanometrics ECV Pro Profiler
  • VEECO / WYKO NT 9300 Surface Profiler (including 50X optics)
  • Zygo ZeMapper non-contact 3D Profile