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Infrastructure

Veeco GEN200 (8-Inch) silicon molecular-beam epitaxy (MBE) system.

Equipment

The MDL contains over 130 individual pieces of processing equipment, including systems for ultraviolet (UV) contact and projection lithography, electron-beam lithography, materials growth and deposition, wet and dry etching, thermal processing, and optical, structural, and electronic characterization.

Because the MDL focuses on unique devices for space applications rather than the mass production of commodity chips, production equipment is not always suitable. MDL equipment is often smaller in scale, and may be custom built for specific requirements.

MDL Equipment Complement

Material Deposition

Material Deposition

  • Thermal Evaporators (6)
  • Electron-Beam Evaporators (7)
  • Ultra-High-Vacuum (UHV) Sputtering Systems for Dielectrics and Metals (3)
  • Ultra-High-Vacuum (UHV) Sputtering Systems for Superconducting Materials (2)
  • AJA Load-Locked Thermal Co-Evaporator for Broadband IR Bolometer Depositions
  • Plasmatherm 790 Plasma Enhanced Chemical Vapor Deposition (PECVD) for Dielectrics
  • Oxford Plasmalab System 100 Advanced Inductively Coupled Plasma (ICP) 380 High-Density Plasma Enhanced Chemical Vapor Deposition (HD PECVD) System for Low-Temperature Dielectric Growths
  • Oxford Plasmalab 80 OpAL Atomic Layer Deposition (ALD) System with Radical Enhanced Upgrade
  • Beneq TFS-200 Atomic Layer Deposition (ALD) System
  • Low-Pressure Chemical Vapor Deposition (LPCVD) (Tystars) with 6 Tubes for
    • Low Stress Silicon Nitride (2)
    • Low Temperature Oxide – Silicon Dioxide
    • Doped and Undoped Polysilicon
    • Wet Pyrogenic Oxidation
    • Steam Oxidation
  • Carbon Nanotube Furnace Systems (2)
  • Electroplating Capabilities
  • Molecular-Beam Epitaxy (MBE)
    • Veeco GEN200 (8-inch) Si MBE for UV CCD Delta Doping (Silicon)
    • Veeco Epi GEN III MBE (Antimonide Materials)
    • Riber MBE for UV CCD Delta-Doping (Silicon)
    • Riber Device MBE (GaAs)
  • Thomas Swann Metallo-Organic Chemical Vapor Deposition (MOCVD) System

Lithographic Patterning

Lithographic Patterning

  • Electron-Beam (E-beam) Lithography: JEOL JBX9300FS E-beam lithography system with a 4-nm spot size, 100,000-volt acceleration voltage, ability to handle wafers up to 12 inches in diameter, and hardware and software modifications to deal with curved substrates having up to 7 mm of sag
  • GCA Mann Wafer Stepper with custom stage allowing different sizes and thicknesses of wafers (0.7-µm resolution)
  • Canon FPA3000 i4 i-Line Stepper (0.35-µm resolution)
  • Canon FPA3000 EX3 Stepper with EX4 Optics (0.25-µm resolution)
  • Canon FPA3000 EX6 DUV Stepper (0.15-µm resolution)
  • Contact Aligners:
    • Karl Suss MJB3
    • Karl Suss MJB3 with backside IR
    • Suss MA-6 (UV300)
    • Suss BA-6 (UV400) with jigging supporting Suss bonder
  • Wafer Track/Resist/Developer Dispense Systems:
    • Suss Gamma 4 Module Cluster System
    • Site Services Spin Developer System
  • Yield Engineering System (YES) Reversal Oven
  • Ovens, Hotplates, and Manual Spinners

Dry Etching

Dry Etching

  • Commonwealth IBE-80 Ion Mill
  • Branson Plasma Ashers
  • Tepla PP300SA Microwave Plasma Asher

Fluorine-Based Plasma Etching Systems

Fluorine-Based Plasma Etching Systems

  • STS Deep Trench Reactive Ion Etcher (DRIE) with SOI Upgrade
  • Unaxis Shuttleline Load-Locked Fluorine ICP RIE
  • Plasmaster RME-1200 Fluorine RIE
  • Plasma Tech Fluorine RIE
  • STJ RIE for Superconductors
  • Custom XeF2 etcher

Chlorine-based Plasma Etching Systems

Chlorine-based Plasma Etching Systems

  • Unaxis Shuttleline Load-Locked Chlorine ICP RIE
  • Plasmaster RME-1200 Chlorine RIE
  • ECR 770 Chlorine RIE
  • Oxford Inductively Coupled Plasma (ICP) Chlorine RIE

Wet Etching & Sample Preparation

Wet Etching & Sample Preparation

  • RCA Acid Wet Bench for 6-inch Wafers
  • Solvent Wet Processing Benches (7)
  • Rinser/Dryers for Masks and Wafers
  • Chemical Hoods (7)
  • Acid Wet Processing Benches (8)
  • Tousimis 915B Critical Point Dryer
  • Rapid Thermal Processors/Contact Alloyers (2)
  • Polishing and Planarization Stations (5)
  • Strasbaugh 6EC Chemical Mechanical Polisher
  • Precitech Nanonform 250 Ultra Diamond Point Turning System
  • SET North America Ontos 7 Native Oxide (Indium Oxide) Removal Tool
  • SurfX 400L Atmospheric Surface Preparation System
  • New Wave Research EzLaze 3 Laser Cutting System
  • Indonus HF VPE-150 Hydrofluoric Acid Vapor Phase Etcher

Packaging

Packaging

  • SET FC-300 Flip-Chip Bump Bonder
  • Karl Suss Wafer Bonder
  • Electronic Visions Wafer Bonder
  • Fynetech Fineplacer 96 “Lambda” Bump Bonder
  • Thinning Station and Inspection Systems for CCD Thinning
  • Wire Bonding
  • DISCO 320 and 321 Wafer Dicers (2)
  • Tempress Scriber
  • Pick and Place Blue Tape Dispenser System
  • Loomis LSD-100 Scriber Breaker
  • SCS Labcoter 2 (PDS 2010) Parylene Coating System

Characterization

Characterization

  • Profilometers (2)
  • FSM 128 Film Stress Measuring system
  • FISBA µPhase 2 HR Compact Optical Interferometer
  • Senetech SE 850 Multispectral Ellipsometer
  • Horiba UVISEL 2 (190-2100 nm) Ellipsometer
  • Dimension 5000 Atomic Force Microscope (AFM)
  • KLA-Tencor Surfscan 6220 Wafer Particle Monitor
  • JEOL JSM-6700 Field Emission SEM with EDS
  • Nikon and Zeiss Inspection Microscopes with Image Capture (3)
  • Olympus LEXT 3D Confocal Microscope
  • Electrical Probe Stations with Parameter Analyzers (2)
  • RPM2035 Photoluminescence Mapping System
  • Fourier Transform Infrared (FTIR) Spectroscopy
  • PANalytical X’Pert Pro MRD with DHS High Temperature Stage X-ray Diffraction System
  • Surface Science SSX501 XPS with Thermal Stage
  • Custom Ballistic Electron Emission Microscopy (BEEM) System
  • Custom UHV Scanning Tunneling Microscope (STM)
  • Nanometrics ECV Pro Profiler
  • VEECO / WYKO NT 9300 Surface Profiler