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Submillimeter-Wave Advanced Technologies

DRIE Technology for the Fabrication of Submillimeter-Wave Components

Overview
JPL is using deep reactive ion etching (DRIE)-based silicon micromachining capabilities to develop the critical waveguide components at submillimeter wavelengths that will lead to highly integrated multipixel spectrometers, imagers, and radars. A silicon-based quadrature hybrid working in the 325–500-GHz range has been designed and initial fabrication is in progress.

Part of the 325-GHz quadrature hybrid showing surface roughness measurement

Highlights (2008-2009)
Silicon micromachining was utilized to fabricate a quadrature hybrid at 325 GHz.

 

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